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 BAS69 Series
Low capacitance small signal Schottky diodes
Main product characteristics
IF VRRM C (typ) Tj (max) 10 mA 15 V <1 pF 150 C
BAS69KFILM (Single)
SOD-523
Features and benefits

Low diode capacitance Designed for RF applications Low profile packages Very low parasitic inductor and resistor
BAS69WFILM (Single) BAS69-05WFILM (Common cathode) BAS69-06WFILM (Common anode) BAS69-04WFILM (Series)
SOT-323
Description
The BAS69 series use 15V barrier, with extremely low junction capacitance, suitable for the detection of an RF signal and the compensation of the voltage drift with the temperature. The presented packages make the device ideal in applications where space saving is critical. The low junction capacitance will reduce the disturbance on the RF signal.
BAS69-07P6FILM (2 parallel diodes)
SOT-666
BAS69-09P6FILM (2 opposite diodes)
Order codes
Part Number BAS69WFILM BAS69-04WFILM BAS69-05WFILM BAS69-06WFILM BAS69KFILM BAS69-09P6FILM BAS69-07P6FILM Marking 23 24 25 26 65 69 67
Configurations in top view
July 2006
Rev 1
1/9
www.st.com
Characteristics
BAS69 Series
1
Table 1.
Symbol VRRM IF IFSM Tstg Tj TL
Characteristics
Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified)
Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Maximum soldering temperature(1)
(1)
Value 15 10 Half wave, single phase 60 Hz 2 -65 to +150 150 260
Unit V mA A
C
1. Pulse test: tp = 380 s, < 2 %
Table 2.
Symbol Rth(j-a)
Thermal parameters
Parameter Junction to ambient(1) SOT-323 SOD-523, SOT-666 Value 550 C/W 600 Unit
1. Epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter Test conditions Tj = 25 C VR = 1 V Min. Typ Max. 0.035 6 30 A 0.23 VR = 15 V 10 350 IF = 1 mA 230 500 IF = 10 mA 460 100 380 260 mV 570 510 Unit
IR(1)
Reverse leakage current
Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C
VF(1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp 250 ms, 2 %
Table 4.
Symbol C RF LS
Dynamic characteristics
Parameter Diode capacitance Forward resistance Series inductance Test conditions VR = 0 V, F = 1 MHz IF = 5 mA, F = 100 MHz 15 1.5 Min. Typ Max. 1.0 Unit pF nH
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BAS69 Series
Characteristics
Figure 1.
Forward voltage drop versus forward current (typical values)
Figure 2.
Reverse leakage current versus reverse voltage applied (typical values)
1.E+02
IFM(mA)
1.E+02
IR(A)
Tj=125C
1.E+01
1.E+01
Tj=85C
1.E+00
Tj=125C
1.E-01
1.E+00
Tj=85C Tj=25C Tj=-40C
Tj=25C
1.E-02
VFM(V)
1.E-03
1.0 1.2
VR(V)
0.0 2.5 5.0 7.5 10.0 12.5 15.0
1.E-01 0.0 0.2 0.4 0.6 0.8
Figure 3.
Differential forward resistance versus forward current (typical values)
F=10kHz Tj=25C
Figure 4.
Junction capacitance versus reverse voltage applied (typical values)
F=1MHz Vosc=30mVRMS Tj=25C
100
RF()
C(pF)
1.0 0.9 0.8 0.7 0.6
10
0.5 0.4 0.3 0.2
IF(mA)
1 1.0 10.0 100.0
0.1 0.0 0.0 2.5 5.0
VR(V)
7.5 10.0 12.5 15.0
Figure 5.
Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-323)
Single pulse SOT-323
Figure 6.
Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-666)
Single pulse SOT-666
Zth(j-a) /Rth(j-a)
1.E+00
Zth(j-a) /Rth(j-a)
1.E+00
1.E-01
1.E-01
1.E-02
Epoxy FR4 SCU=2.25 mm eCU=35 m
tP(s)
1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
tP(s)
1.E-02
1.E+03
Epoxy FR4 eCU=35 m
1.E+02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
3/9
Ordering information scheme
BAS69 Series
Figure 7.
Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-523)
Figure 8.
Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4 - SOT-323)
Zth(j-a) /Rth(j-a)
1.E+00
Single pulse SOD-523
600
Rth(j-a)
550
1.E-01
500
450
1.E-02
400
tP(s)
Epoxy FR4 eCU=35 m
350
SCU(mm)
300
1.E-03 1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0
5
10
15
20
25
30
35
40
45
50
2
Ordering information scheme
BAS69
Signal Schottky diodes VRRM = 15 V Configuration No letter = Single diode 04 = Series diodes 05 = Common cathode 06 = Common anode 07 = Parallel diodes 09 = Opposite diodes Package W = SOT-323 K = SOD-523 P6 = SOT-666 Packing FILM = Tape and reel
xx
xx FILM
4/9
BAS69 Series
Package information
3
Package information
Epoxy meets UL94, V0 Table 5. SOD-523 dimensions
Dimensions
E 0.15 M C A B E1 B
Ref.
Millimeters Min. Typ. 0.60 1.60 1.20 0.80 Max. 0.70 1.70 1.30 0.90 0.35 0.20 0.20 0.25 0.20 Min.
Inches Typ. Max.
2xb
D
A E
0.50 1.50 1.10 0.70 0.25 0.07 0.15 0.10
0.020 0.024 0.028 0.059 0.063 0.067 0.043 0.047 0.051 0.028 0.031 0.035 0.010 0.003 0.014 0.008
0.20 M C A B A R0.1 8
E1 D
A
SEATING PLANE
c C L 7
b c
L1
L L1
0.006 0.008 0.010 0.004 0.008
Figure 9.
SOD-523 footprint (dimensions in mm)
0.7 0.3 2
5/9
Package information Table 6. SOT-323 dimensions
Dimensions Ref.
A E
BAS69 Series
Millimeters Min. Typ. Max. 1.1 0.1 0.4 0.26 2.0 1.25 0.65 1.8 0.1 0 2.1 0.2 2.4 0.3 30 0.071 0.004 0 2.2 1.35 Min. 0.031 0.0 0.010 0.004 0.071 0.045
Inches Typ. Max. 0.043 0.004 0.016 0.010 0.079 0.049 0.026 0.083 0.008 0.094 0.012 30 0.086 0.053
A
e b
D
0.8 0.0 0.25 0.1 1.8 1.15
A1 b c
A1
D E
c H
e
L
H L q
Figure 10. SOT-323 footprint (dimensions in mm)
0.95
1.0
2.9
0.8
0.50
6/9
BAS69 Series Table 7. SOT-666 dimensions
Package information
Dimensions
b1 L1
Ref.
Millimeters Min. Typ. Max. Min.
Inches Typ. Max. 0.024 0.007 0.013
L3 b
A A3 b
D E1
0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27
0.60 0.018 0.18 0.003 0.34 0.007
b1 D
0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051
A
E
L2 E A3
E1 e L1 L2
e
L3
Figure 11. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
7/9
Ordering information
BAS69 Series
4
Ordering information
Part Number BAS69WFILM BAS69-04WFILM BAS69-05WFILM BAS69-06WFILM BAS69KFILM BAS69-09P6FILM BAS69-07P6FILM Marking 23 24 25 26 65 69 67 Package SOT-323 Single SOT-323 Series SOT-323 Common cathode SOT-323 Common anode SOD-523 Single SOT-666 Opposite SOT-666 Parallel Weight 6 mg 6 mg 6 mg 6 mg 1.4 mg 2.9 mg 2.9 mg Base qty 3000 3000 3000 3000 3000 3000 3000 Delivery mode Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel Tape and reel
5
Revision history
Date 24-Jul-2006 Revision 1 First issue Description of Changes
8/9
BAS69 Series
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